1order of copper layers:
2    Copper 1: Front
3    Copper 2: Inner3
4    Copper 3: Inner2
5    Copper 4: Back
6
7PCB description: 4 layer PCB 0.062 in
8    Copper        1   0.5 oz foil plated to approximately 0.0017 in
9    Dielectric  1-2   0.0119 in
10    Copper        2   1 oz foil (0.0014 in)
11    Dielectric  2-3   0.0280 in
12    Copper        3   1 oz foil (0.0014 in)
13    Dielectric  3-4   0.0119 in
14    Copper        4   0.5 oz foil plated to approximately 0.0017 in
15FR4 or similar substrate with Er=4.5 (+/- 0.1)
16double side solder mask black
17single side silkscreen white
186 mil min trace width and
196 mil min isolation
20